商品详情
TMP61-Q1 Automotive Grade, ±1% 10-kΩ Linear Thermistor With 0402 and 0603
Package Options
1 Features
• Automotive Qualifications
– AEC-Q100 Grade 1: –40 °C to 125 °C
– AEC-Q100 Grade 0 (DYA): –40 °C to 150 °C
– AEC-Q100 Grade 0 (ELPG): –40 °C to 170 °C
• AEC-Q200 Tested
• Functional Safety-Capable
– Documentation available to aid functional safety
system design
• Silicon-based thermistor with a
positive temperature coefficient (PTC)
• Linear resistance change across temperature
• 10-kΩ nominal resistance at 25 °C (R25)
– ±1% maximum (0 °C to 70 °C)
• Consistent sensitivity across temperature
– 6400 ppm/°C TCR (25 °C)
– 0.2% typical TCR tolerance across temperature
range
• Fast thermal response time of 0.6 s (DEC)
• Long lifetime and robust performance
– Built-in fail-safe in case of short-circuit failures
– 0.5% typical long term sensor drift
2 Applications
• Thermal compensation
– Display backlight
– Battery management systems
• Thermal threshold detection
– Motor control
– _disibledevent=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 29-Dec-2020
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP61-Q1 :
•
Catalog: TMP61
NOTE: Qualified Version Definitions:
•
Catalog - TI's standard catalog product
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TMP6131QDECRQ1 X1SON DEC 2 10000 178.0 8.4 0.7 1.15 0.47 2.0 8.0 Q1
TMP6131QDECTQ1 X1SON DEC 2 250 178.0 8.4 0.7 1.15 0.47 2.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2020
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP6131QDECRQ1 X1SON DEC 2 10000 205.0 200.0 33.0
TMP6131QDECTQ1 X1SON DEC 2 250 205.0 200.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2020
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
0.50
0.41
0.05
0.00
0.65
0.1 C A B
2X 0.55
0.45
2X 0.3
0.2
A 1.05
0.95 B
0.65
0.55
4224506/A 08/2018
DEC0002A X1SON - 0.5 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
PIN 1 INDEX AREA
SEATING PLANE
0.03 C
1 2
0.1 C A B
SYMM
SYMM
(45 X0.125)
PIN 1 ID
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M
2. This drawing is subject to change without notice.
SCALE 11.000
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EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND 0.07 MAX
ALL AROUND
(R0.05) TYP
(0.65)
2X (0.5)
2X (0.25)
4224506/A 08/2018
DEC0002A X1SON - 0.5 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
1
2
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:60X
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view.
It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK DETAILS
METAL EDGE
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
DEFINED
(PREFERRED)
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EXAMPLE STENCIL DESIGN
(R0.05) TYP
(0.7)
2X (0.5)
2X (0.3) (0.05)
4224506/A 08/2018
DEC0002A X1SON - 0.5 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:60X
SYMM
1 2
SYMM
PCB PAD METAL
UNDER SOLDER PASTE
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PACKAGE OUTLINE
C
1.7
1.5
2X 0.35
0.25
2X 0.4
0.2
0.77 MAX
2X 0.15
0.08
2X 0.3
0.1 0.7
0.5 TYP B 1.3
1.1
A
0.85
0.75
NOTE 3
DYA0002A SOT (SOD-523) - 0.77 mm max height
PLASTIC SMALL OUTLINE
4224978/B 09/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEITA SC-79 registration except for package height
1 2
PIN 1
ID AREA
SEATING PLANE
0.05 C
0.1 C A B
0.05
SYMM
SYMM
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EXAMPLE BOARD LAYOUT
0.05 MAX
AROUND
0.05 MIN
AROUND
2X (0.4)
(R0.05) TYP 2X (0.67)
(1.48)
4224978/B 09/2021
DYA0002A SOT (SOD-523) - 0.77 mm max height
PLASTIC SMALL OUTLINE
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
SYMM
1 2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
SOLDER MASK METAL
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDERMASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
2X (0.67)
2X (0.4)
(R0.05) TYP
(1.48)
DYA0002A SOT (SOD-523) - 0.77 mm max height
PLASTIC SMALL OUTLINE
4224978/B 09/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
SYMM
SYMM
1 2
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PACKAGE OUTLINE
4.1
3.9
2X
15.5
15.1
3X 0.48
0.33
2X 1.27 0.05
3.25
3.05
3X 0.51
0.33
3X 0.51
0.40
2X (45°)
0.86
0.66
1.62
1.42
2.64
2.44
2.68
2.28
5.05
MAX
6X 0.076 MAX
2.3
2.0
2 MAX
(0.55)
4221971/A 03/2015
LPG0002A TO-92 - 5.05 mm max height
TO-92
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
1 2
1 2
SCALE 1.300
www.ti.com
EXAMPLE BOARD LAYOUT
TYP
ALL AROUND
0.05 MAX (1.07)
(1.7)
(1.27)
(2.54)
(R0.05) TYP (1.07)
(1.7)
3X ( 0.75) VIA
4221971/A 03/2015
LPG0002A TO-92 - 5.05 mm max height
TO-92
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
METAL
TYP
TYP
OPENING
SOLDER MASK
1 2
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