| 型号 | 功能描述 | 生产厂商 | 厂商LOGO | PDF大小 | PDF页数 | PDF文件 | 相关型号 | 第一页预览 | 产品购买 |
| 70246 | B120,10X14,RED,BLK/WHT,COMBUSTIB | Brady Corporation |  | 120.99 Kbytes | 共3页 |  | |
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| 70246-0801 | 2.54mm (.100) Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO-天天IC网](https://cache.ttic.cc/PdfSupLogo/830MOLEX8.GIF) | 187.73 Kbytes | 共4页 | | |
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| 70246-0802 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-1001 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.74 Kbytes | 共4页 | | |
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| 70246-1002 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.74 Kbytes | 共4页 | | |
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| 70246-1004 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13μm (5μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 188.07 Kbytes | 共4页 | | |
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| 70246-1201 | 2.54mm CGrid Hdr Shrd /Slt .38AuLF 12Ckt | Molex Incorporated |  | 26.90 Kbytes | 共2页 | | |
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| 70246-1202 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-1401 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-1402 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-1404 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin (Sn) PC TailPlating | MOLEX8[Molex Electronics Ltd.] | | 187.98 Kbytes | 共4页 | | |
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| 70246-1601 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-1602 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-1604 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.98 Kbytes | 共4页 | | |
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| 70246-2001 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-2002 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-2004 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.98 Kbytes | 共4页 | | |
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| 70246-2401 | 2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 24 Circuits, 0.38um (15u") Gold (Au) | MOLEX8[Molex Electronics Ltd.] | | 187.7 Kbytes | 共4页 | | |
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| 70246-2402 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 24Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-2501 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-2601 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-2602 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-2604 | 2.54mm (.100) Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.98 Kbytes | 共4页 | | |
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| 70246-3001 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.74 Kbytes | 共4页 | | |
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| 70246-3002 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-3004 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.98 Kbytes | 共4页 | | |
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| 70246-3401 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-3402 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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| 70246-3404 | 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating | MOLEX8[Molex Electronics Ltd.] | | 187.98 Kbytes | 共4页 | | |
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| 70246-4001 | 2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits | MOLEX8[Molex Electronics Ltd.] | | 187.75 Kbytes | 共4页 | | |
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